ADVANCED IC PACKAGING TECHNIQUES : Evolution and Current Trends
The industry is developing new advanced package types or expanding the prevailing technologies. The fundamental idea behind advance packaging is to cram all chip functions on the same die, break the pieces up and integrate them in a package. This reduces the cost/price and provides better yields. Another option is to bring the chips closer to each other. Many advanced packages bring the memory closer to the processor, which enables faster access to the data with lower latencies. There are several challenges in IC packaging. Also, there is no one package type that fits all needs. The overview of some advanced IC packaging techniques is given below:
Fan-out is expanding into new forms. Among them are:
Fan-out system-in-package (SiP): A SiP is a multi-die package that performs a specific function. A fan-out SIP may incorporate dies and passives.
A system in package, or SiP, is a way of bundling two or more ICs inside a single package. While SiP saw limited adoption in its forms, there has been much work done on improving this concept recently with 2.5D and 3D-ICs, as well as package-on-package and flip-chips. There are several key drivers for these changes:
- Analog IP doesn’t shrink as easily as digital circuits from one process node to the next, making it extremely time-consuming and costly to move IC designs from one process node to the next in accordance to Moore’s Law. Being able to shrink just the digital portions and keep analog at older process geometries is increasingly attractive.
- Shrinking features and adding more functionality onto semiconductors requires longer and thinner wires, which increases the time it takes for signals to move around a chip. By packaging different chips together, connected through an interposer or through-silicon via, those signals can be speeded up using shorter wire distances and wider conduits.
- The need to extend battery life in mobile devices will require ways of reducing the amount of power needed to drive signals. Reducing the distances that signals have to travel, particularly in and out of memory, and increasing the width of the conduits, have a direct effect on the amount of energy expended to drive signals.
2.5D/3D: Here, Chips are placed side-by-side or on top of each other in a package. A 2.5D/3D technologies, is a die stacking technique that promises to boost the bandwidth in devices. 2.5D/3D technologies, though, are relatively expensive, limiting the market to high-end applications. 2.5D will continue its slow growth in the HPC (high-performance computing) and automotive sectors for specific applications. However,2.5D/3D technologies have some scaling limitations. There are issues with the bumps/pillars and the tools. In 2.5D/3D technologies, dies incorporate tiny bumps on one side. The bumps on each die are connected using thermal compression bonding (TCB). A TCB bonder uses force and heat to connect the bumps. This is a slow process. The bonding process has a low throughput and cannot overcome the challenge of scaling below a 40μm pitch. Nowadays, most advanced micro bumps and pillars are tiny structures with a 40μm pitch.
If you want to know more about the terms in advanced IC packaging do check our blog:
https://basictermsinicpackaging.blogspot.com/
ADVANTAGES OF ADVANCED IC PACKAGING
Advanced IC packaging technologies are pushing printed circuit board (PCB) suppliers towards smaller pitches, better power integrity, and thermal conductivity, to name a few. Shrinking package and board geometries significantly reduces parasitic capacitance and power dissipated in interconnects, resulting in much higher performance per Watt, longer battery life for handheld devices, and lower system cost. Many other electronic systems rely on ICs to increase the number and quality of features, improve safety, reliability, and enable user-friendly operation. Lower power consumption because of their smaller size.
IC PACKAGING EVOLUTION SINCE 1970’s.
ADVANCED PACKAGING MARKET SHARE EVOLUTION 2014-2025
In 2014, AP market share was 38% and there is strong possibility that in 2026, AP market share will exceed that of traditional packaging. In 2019, the AP market share was 42.6%. Due to strong momentum in AP market driven by mega trends, the share of AP in the total semiconductor market is increasing continuously and will reach almost 50% of the market by 2025.Advanced Packaging revenue will almost equal to traditional packaging revenue by 2025.
Packaging technology plays an important role in the realisation of a new generation of products. This requires the development of new packaging technologies and materials. The estimation of packaging technologies can be done by an indicator the so called packaging efficiency. It is defined by the ratio of the silicon chip to the area of the package. The best level of efficiency for peripheral packages, like QFP, can reach 50%; for area array package like BGA/CSP does not exceed 90% and for wafer scale or bare chip solutions can achieve 100% silicon efficiency.
CURRENT TRENDS IN ADVANCED IC PACKAGING
Let's Summarise
In this blog, we covered all that you need to know about advanced IC packaging. We gave an overview of some advanced IC packaging techniques and several key factors that are driving this change. We discussed the advantages of these advanced IC packaging techniques as well as the evolution of IC packaging from 1970 to 2025.We also discussed about the current trends in the advanced IC packaging market.
“The only constant in life is change”-Heraclitus.
References:
https://www.edn.com/lost-in-the-advanced-ic-packaging-labyrinth-know-these-10-basic-terms/
https://www.edn.com/heterogeneous-integration-and-the-evolution-of-ic-packaging/
https://semiengineering.com/five-trends-in-ic-packaging/
https://www.semiconductors.org/wp-content/uploads/2020/09/Santosh-
Kumar_Yole_Advanced-Packaging-Current-Trends-and-Challenges.pdf
AUTHOR: RIYA KAKTIKAR
We hope you’ve enjoyed reading this blog. In case of queries, Please feel free to drop your queries in the comment section
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DeleteWill definitely write an article dedicated to this topic. You can check the links mentioned in the blog for more information and news related to Advanced IC packaging.
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Will definitely write an article dedicated to this topic. You can check the links mentioned in the blog for more information and news related to Advanced IC packaging.
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