An Overview of Advanced IC Packaging Techniques.

“Evolution is the secret of the next step” Similarly, have you ever thought that there can be evolution in IC packaging? Remarkable, isn’t it?  Advanced IC p ackaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting multiple chips in advanced packages as an alternative to chip scaling. Let’s get started, IC packaging is becomes more complex and expensive at each node ,finding challenges and solutions to it is becoming more important. The normal chip designs become more unwieldy that several IC vendors are exploring alternative approaches for packaging ICs. There are some traditional ways to advance chip design and packaging. One way to advance a chip design is to assemble different and advanced dies in a package. Advanced packaging is especially used for higher-end projects, due to cost. IC scaling which is a traditional way of advancing a design, shrinks differen